• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps, dryer steps and the like, with preferably uniform thin copper coatings thereon, and thereafter the boards are subsequently plated with a thicker copper coating, preferably by means of an electroplating process.
    公开号:SU1660595A3
    申请号:SU853990693
    申请日:1985-12-18
    公开日:1991-06-30
    发明作者:Л.Гоффредо Даниель；Й.Мейер Вальтер；Блейзинг Хорст
    申请人:Шеринг Аг (Фирма)；
    IPC主号:
    专利说明:

    The invention relates to equipment for processing flat products during their manufacture.
    The purpose of the invention is to increase productivity and improve the quality of the coating.
    FIG. 1 schematically shows the proposed device: in FIG. 2 - PCB during chemical recovery, cross section; in fig. 3 - the same (deposition of copper in the through hole of the printed
    fees after the position of electroplating).
    A device for the chemical treatment of flat products, mainly printed circuit boards 1, contains located on the basis of the means 2 supply of printed circuit boards 1 to chamber 3 for preparing the surface of the boards for metal deposition on their surface, made in the form of rotating rollers 4. Chamber 3 contains tanks 5 with 6 and outlet 7 holes and with a working fluid 8. located at level 9, with a pump 10, feed mechanisms
    ON Os О СЛ О СЛ
    | Ы
    Hidosti in the form of nozzles 11 and nozzles 12 Nozzles 11 have channels 13, nozzles are connected to pipeline 14.
    The device also includes means of transporting printed circuit boards in a horizontal position in the form of rollers 15, an activation chamber 16, a recovery solution chamber 17, a chemical activating solution chamber 18c, a sprayer 19, a settling tank 20, a pipeline 21. a pump 22.
    The printed circuit board 1 (FIG. 2) consists of an inner layer 23 of plastic resin reinforced with glass fiber, a copper outer surface word 24 (and, if necessary, of one or more inner layers of copper, not shown). The board has an opening 25 extending from one outer surface 26 to the other.
    Camera 17 has an input module 27 and an output module 28.
    The device also includes a bath 29 for chemical deposition of metal, means for rotating the plates from a horizontal to a vertical position with rotating elements 30 in the form of rollers 31 and 32, a guide element 33 with a curved surface 31, means for transporting in a vertical position in the form of a continuous transport tape 35c. 36, rod 3 /, cylinder 38, signal line 39, control unit 40, control bus 41. motor 42, timing device 43, drive roller 44, means for turning the board from a vertical to horizontal in the form of rollers 5 and 46, guiding the curvilinear surface 47, rotating elements 48, Bath 29 has an outlet 49.
    The device also includes a rod 60, cylinder 51, time relays 52. Camera 17 snaps out the sump 53, pump 54, Nozzles 55, nozzles 56, pipeline 57,
    In addition, the device includes control lines 58, 59, heater 60.
    A printed circuit board (FIG. 3) contains a central layer 61, copper surfaces 62 and 63. copper coating 64, through hole 65, opposite surfaces 66.
    The device comprises a washing bath 67 with an inlet 49 and an outlet 68. with rotating elements 69, a settling basin (). pump 71, pipelines 72, a spreading mechanism 73, drying chamber 7Ј, fans 75, heating elements 76, pipelines 77, caps 78, exit 79. output position 80, bath 81 for electroplating metal deposited after bath 29
    for chemical metal deposition, a mechanism 82 for unloading the product from the device.
    The input device can be configured as an input module consisting of
    rotating wheels and similar rotating elements. The printed circuit boards are fed to one or more preparatory positions. Chamber 3 may contain degreasing stations for applying chemical fabrics.
    0 on printed circuit boards for the purpose of eliminating smudges or other greasy soils and / or for treating surfaces to prevent them from being oiled. In addition, it may contain one or no5 how many rinsing chambers and one or more etching processes. The roller 4 in the sgm device (Fig. 1) will be activated preferably by a common drive for transporting printed circuit boards (PC) left to the right through the device,
    Chamber 3 typically contains beams 5 having inlet and outlet openings 6 and 7 of a slit type that may or may not have flexible flaps (not shown) for
    5 to prevent the passage of undesirable quantities of fluid into and out of these holes, and for the rest, the nodes are designed to maintain the treatment fluids 8 for a given level 9.
    0 Chamber 3 - has a pump 10 (usually electrically driven) designed to supply the required solutions of degreasing, rinsing, pickling, etc. - through the appropriate
    5 an inkjet-type mechanism with nozzles 11 or a spray type with nozzles 12. The jet-type delivery mechanism usually has channels 13. running across the entire installation to create a curtain or screen from the supplied liquid. Spray type feed mechanisms are mainly located across the installation and are provided with discharge openings for spraying liquid supplied to them from
    B of pump 10 through conduit 14. It should be noted that a greater number of support rollers 15 may be used supporting the printed circuit boards on the upper surface of the conveyors or on other
    0 rotating elements when the boards are exposed to the sprayed processing liquid through the nozzles 12 or nozzles 11 during the passage of the printed circuit boards in the longitudinal direction through
    5 device (Fig. 1),
    After processing the printed circuit boards in the chambers, for example, the B tank 5 in the preparatory preparation cycle Of., They preferably enter one or several activation chambers 16. connected in significant ways to operate with other modules, as a result of which the chemical activating solution acts on the printed circuit board before exposure to a chemical reducing solution in chamber 17,
    In the chamber 16, when the board moves along a predetermined path, a chemical activating solution enters it through the sprayer 19, which is supplied from the settling tank 20 at the base of the chamber 18 through pipelines 21 using a pump 22. Instead of the sprayers 19, filling nozzles can be used.
    The activating solution may be an alkaline solution of palladium.
    To ensure a ph of 7--12 and a working temperature of 20 × 50 ° C, the solution may have the following composition:
    Pt palladium mg / l 10-400
    Sodium hydroxide, g / l3-20
    Bourne acid g / l 5-25
    The complex component, g / l 5-100
    FIG. Figure 2 shows the activation solution on the surface 26 and on the inner surface of the through hole 25 during processing of the printed circuit board and its through hole, which does not have a copper coating.
    As shown in FIG. 1, in the bath 17, the recovery solution is supplied from the settler 53 at its base (in this case one or several tanks can be in position depending on the number and types of treatments performed at this place) using a pump 54 located in the sump 53 , to nozzles 55 or nozzles 56 through pipelines 57.
    A chemical reducing agent or a reducing solution is supplied to the printed circuit boards as they are extended through the bath 17 (Fig. 2). as well as the activation solution
    Recovery p-solution restores complex palladium to metallic palladium in order. to promote rapid copper plating during the subsequent plating operation.
    The reduction solution has the following composition, g / l, in order to have a ph of 8-12 and a working temperature of 20-60 ° C:
    Sodium borohydride 0.1-5
    Phosphate
    sodium 10-80
    The process is carried out with the continuous supply of printed circuit boards through the device. At various locations of the device there may be control modules installed on the supply line between different positions, like drive modules, there may be an output module 27. On which printed circuit boards arrive at the exit from the outlet the last processing module before they enter the bath 29 chemical deposition of metal,
    Immediately before or at the beginning of the sequential transfer of printed circuit boards to the plating bath 29 they are from a horizontal position
    0 is transferred to the vertical, parallel to each other, by any means that would ensure their quick reorientation. One of these environments. Inserts boards from the rotating rollers 30 of the output module 28 and the view between two oppositely rotating rollers 31 and 32, which are preferably driven by the same common drive (not shown) that drives The action of the rotating rollers 4, 30. The rollers 31 and 32 are set as follows. what. when the printed circuit board enters their gap, the left end of the board rises, while the board itself goes "through the gap down, like
    5 is shown by a dotted line on the left side of the tub 29. The printed circuit boards supplied in this manner hit the curved surface 34 and are successively guided into the slots 36 of the drive continuous transport belt 35. The guide member 33 is fixed on the rod 37 of the cylinder 38 moving up and down as shown by a double arrow, for quick setting to the position of the element 33 and its withdrawal,
    5, it did not interfere with the movement to the right of the printed circuit board, which had just been installed in a vertical position in the groove 36 and held in it due to the friction of the side walls of the groove.
    0 The actuation of the cylinder 38 can be controlled by the roller 32 by means of a presence detector, which functions through the signal line 39. Such control of the operation of the cylinder 38 can be electric, pneumatic, hydraulic, etc. and can be synchronized, if necessary, for coordination via control bus 14 with timing of engine 42 and again through matching device 43 for timing, which, in turn, can control clockwise rotation of the drive roller 44 on the left end of the transport roller. tape 35.
    5 Thus, when the printed circuit boards are placed upright in the slots 36 on the upper branch of the conveyor belt 35, and the guide members 33 are retracted upwards so as not to interfere with the movement of the boards, the printed circuit boards will move
    to the right and the direction of the arrow through the electroplating bath 29 with the required speed, which, however, is less than the speed of advancement of the printed circuit boards through the chamber 3, 17 and 18.
    It should be noted that the longitudinal length of the conveyor belt 35 is set such that the required residence time of the printed circuit boards in the bath 29 is dependent on the required thickness of the coating.
    It should be noted that the motor 42 can actuate a mechanism that enables the horizontal movement of the vertically mounted plate in the bath 29 or continuously, or mainly continuously. If the movement is continuous, it is necessary to coordinate the upward removal of the guide element 38 very precisely and precisely choose the time for correct placement of the transverse slots 36 in the tape 35 for receiving printed circuit boards installed therein. However, the essentially continuous horizontal movement of vertically mounted boards in a zanna can be of a step type. The PO of which the transport belt 35 is stopped for a moment every time when the transverse groove 36 reaches the top dead center on the roller 44, while the guide member 33 is in the position shown in FIG. 1. for precisely moving the circuit board groove 36 when it is fed into it by rollers 31 and 32. Then, as. only the printed circuit board will be installed and the groove 36, immediately the cylinder 38 retracts the guide member 33, and as soon as it releases the upper end of the vertically mounted board, the motor 42 moves the upper branch of the transport tape 35 in the longitudinal direction from left to right, as shown in FIG. 1 , by the amount D, which is the distance between adjacent grooves 36, and at this moment the engine 42 is turned off, stopping the movement of the conveyor and all vertically mounted boards located on it, meanwhile the guiding element 33 o is cut off by the action of the cylinder 38 so that the guide position is re-positioned to facilitate the entry of the next PCB into the next notch 36. Thus, such work (from a technical point of view, this is a step-type operation, like a clock mechanism) It is essentially continuous. Exact means for efficiently moving vertically mounted printed circuit boards through anna 29 can fluctuate, if required, from the conveyor and can contain any continuous
    or essentially continuous drive mechanism. It should also be noted that the rollers 31 and 32, the guide element 33 and the cooperating elements are one of the possible means for orienting the printed circuit boards from a horizontal position to a vertical one.
    When the printed circuit boards reach the right end of the bath 29, they are transferred from a vertical position to a horizontal one using any reorientation mechanism. Ne figs. 1 shows one such mechanism, which contains two opposing rollers 45, 46, between which there is a gap to grip the board supplied between them, while the roller 46 is rotated clockwise, as shown in FIG. 1, and the roller 45 is counterclockwise in order to pull the board out of the groove on the upper branch of the conveyor 35, as shown by the dotted line, which again interacts with the guide surface 47. The latter can be stationary and serves to direct the printed circuit board to a rotating electronic circuit. - mekty 48 at the output end of the nna 29 through the outlet 49, made in it.
    It should be noted that the roller 45 in the depicted structure is mounted on the rod 50, driven by the cylinder 51 to move up and down the guide element 33 in order to ensure that the vertically mounted boards pass by it just before the entrance to the gap between the rollers 45 and 46. It should also be noted that a time relay 52 connected to cylinder 51 and connected to the drive roller 46 via control connecting lines 58, 59 can be used to coordinate the activation of the rollers 45, 46 by moving up and down. 50 current.
    In addition, it is desirable to have means for heating bath 29 with an electric or steam heater 60 to maintain bath 29 at the desired temperature.
    The bath 29 contains a solution for chemical copper plating.
    When the electrolyte is a copper solution, then to provide a ph of 10-13.5. working temperature in the range of 20-70 ° C. It may have the following composition, g / lChloride chloride - 15
    Ethylenediaminetetrauscousna
    sodium hydroxide 5-25
    Sodium hydroxide 5-15
    Formaldehyde3 18
    The deposition rate of 2 to 10 μm / h
    In the bath 29, precipitation of other metals can occur instead of currentless copper plating, for example, there can be solutions for chemical coating of nickel, cobalt, silver, gold or other alloys. When bath 29 contains, for example, a nickel solution, it can have the following composition ph4-10, working temperature, in the range of 20-5 J C, g / l.
    Nickel sulfate S-50
    Sodium beef pit 10-50
    And, -, iak1 -50
    Hydroxy acid 1-0
    The complex component (g of sodium mercury or sodium lactate, or fatsetnatril) 20-8C
    With zbil ator0,01-5
    Speed osahdeni µm / h. Ka v Iok tano MB FIG. 3, printed circuit board i contains a center-shank. a layer (core) 61 of 1asti; glassy-reinforced glass fiber, copper surfaces 62 and 63 and has a copper coating 6 applied in a through-hole 65, between the opposite surfaces of G6, and also with a copper coating of tanna 29, which was placed on copper surfaces 62 and 63. The length of the choke hole made in plate 1 is usually several times its diameter
    After exiting the printed circuit boards 29, being again in a horizontal position, they are supplied to the respective processing positions, where they are exposed to rinsing liquid, liquid to prevent tarnishing, subsequent rinsing operations, etc., which are usually followed by fig 1 shows a schematic representation of a device for opening anti-tarnishing and subsequent opresk, and containing a chamber 57, having an inlet 49 and an outlet 68 and equipped with driving rotating elements 69, preferably itelno drive schimis by the same drive that drives the rotating action of the rollers 4, 30, etc. In the sump 70 of the chamber 67, a pump 71 is installed, which supplies the appropriate rinsing liquid, anti-fade, and the like. through pipelines 72 and the spraying mechanism 73 (which can be replaced with a filling nozzle, if necessary) for wet processing of printed circuit boards as they pass through chamber 70. Then the printed circuit boards pass through chamber 74, where air pumps are, or fans 75. or similar devices, equipped with heating elements 76, supply heated air through pipelines 77 through coppack 78 Hd printed circuit boards passing between them to exit 79, through which they enter output position 80 s then
    h 81 for galvanic conviction of metal, zatham. moving in the direction of flow, the board is rinsed and CI / UJKC monitored and rinsed
    Tzkpm obgzzom, device cleaning the surface of the product, rinsing 1 bath, rinsing etching, drying, very good, putting metal coating on the surface of the printed circuit board by chemical deposition and electroplating
    Sda.kdenie metal.
    权利要求:
    Claims (3)
    [1]
    Formula 1. The device for chemical processing of flat ware, mainly printed circuit boards, containing
    on the basis of the means of supplying the products, the chamber for preparing the surface of the product for metal deposition, the vacuum bath, the bath for chemical precipitation of the metal on the surface of the product and the mechanism for the transfer of the normalization of the products in a horizontal position relative to the base, in order to increase productivity and improve the quality of the coating, it is provided with a means for raising the products from the horizontal position to the vertical position relative to the base located at the entrance to the bath for chemical precipitation metal means for transporting products
    in the vertical relative to the base position, located in the bath for chemical precipitation of the metal, means for rotating the articles from the vertical position to the horizontal relative to the base, located at the outlet of the bath for chemical deposition of the metal.
    [2]
    2 The device according to claim 1, of which it is provided with a cameo for drying articles.
    [3]
    3. The device according to claim 1, wherein it is equipped with a bath for galvanic deposition of metal located after the bath for chemical precipitation of metal
    KB
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    I) U About d t Stom i V 7
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    类似技术:
    公开号 | 公开日 | 专利标题
    SU1660595A3|1991-06-30|Device for chemical treatment of flat items, primarily printed circuit boards
    US4534843A|1985-08-13|Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
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    US5374346A|1994-12-20|Electroplating process and composition
    US4654089A|1987-03-31|Counterflow spray rinse process
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    EP0622125B1|1998-02-11|Fluid treatment apparatus
    US4427019A|1984-01-24|Chemical process apparatus
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    US1997013A|1935-04-09|Method and apparatus for treating pipes
    US3276983A|1966-10-04|Method and apparatus for movement of workpieces in a plating machine
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    JPH08172271A|1996-07-02|Plating method of printed-circuit board
    DE102006033072B4|2008-11-13|Method and device for coating substrates by immersion in a molten metal
    KR20060025362A|2006-03-21|Copper plating apparatus
    USRE28174E|1974-09-24|Apparatus for liquid treatment of flat materials
    JPH0754198A|1995-02-28|Transporting mechanism and automatic plating device utilizing the same
    同族专利:
    公开号 | 公开日
    GB2174107B|1989-04-19|
    DE3543286C2|1993-08-19|
    JPS61246372A|1986-11-01|
    ATA361585A|1992-01-15|
    GB2174107A|1986-10-29|
    CH668270A5|1988-12-15|
    US4576685A|1986-03-18|
    FR2580671B1|1989-07-28|
    CN1015996B|1992-03-25|
    BE903914A|1986-04-16|
    IT1215167B|1990-01-31|
    CN85108685A|1986-10-22|
    SE463625B|1990-12-17|
    JPH0571665B2|1993-10-07|
    BG60260B2|1994-03-24|
    NL8503147A|1986-11-17|
    AT395022B|1992-08-25|
    LU86221A1|1986-04-14|
    GB8531409D0|1986-02-05|
    DE3543286A1|1986-10-23|
    IT8567980D0|1985-11-22|
    FR2580671A1|1986-10-24|
    SE8505859D0|1985-12-11|
    SE8505859L|1986-10-24|
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    优先权:
    申请号 | 申请日 | 专利标题
    US06/726,049|US4576685A|1985-04-23|1985-04-23|Process and apparatus for plating onto articles|
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